Test of PCB/PCBA-NG28

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Home > Our Services > Electronic & Electrical Appliances > Testing > Reliability > Service Details

Test of PCB/PCBA

Printed boards or printed board assemblies is the critical part of electronic products. And its quality and reliability level determines the quality and reliability of the final products. NG28 can provide test service about PCB/PCBA products for mechanical properties, electrical properties, thermal properties, environmental reliability testing, failure analysis and so on. These tests assist in product design and provide a powerful support to improve product quality and reliability.

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? Business Challenges

How is the reliability of PCB or PCBA ensured?

How is PCB or PCBA verified and analyzed to solve product quality problems?

? Service content

Ⅰ. Applicable Test Standards

J-STD-003 Solderability Tests for Printed Boards

GB/T 4588.1 Sectional specification:single and double sided printed boards with plain holes

GB/T 4588.2 Sectional specification:single and double sided printed boards with plated-through holes

GB/T 4588.3 Design and use of printed boards

GB/T 4588.4 Sectional specification for rigid multilayer printed boards

GB/T 4677 Test methods of printed boards

GB/T 4722 Test methods for rigid copper clad laminates for printed circuits board

IPC-5704 Cleanliness Requirements For Unpopulated Printed Boards

IPC-6012 Qualification And Performance Specification For Rigid Printed Boards

IPC-6013 Qualification And Performance Specification For Flexible/Rigid-Flexible Printed Boards

IPC-9704Printed Wiring Board Strain Gage Test Guideline

IPC-A-600J Acceptability Of Printed Boards

IPC TM-650 Test Methods Manual, etc.

Ⅱ. Product Range

Electrical and electronic products, equipment.

Ⅲ. Standard Sample Requirements

Please contact our business or customer service, based on specific standards.

Ⅳ. Test Item

Main test items
Cross-section analysis	Flammability
Scanning electron microscopy /Quantitative analysis by Energy-Dispersive Spectroscopy	Bow and Twist
Fourier transform infrared spectroscopy spectrum analysis	Flexural strength of laminates
X-ray inspection	Peel strength of metallic clad laminates
Pull test of solder joints/ Shear strength of solder joints	Land Bond Strength
Coating thickness	Breakdown voltage
Dyeing test	Withstand voltage
Test method for measuring whisker growth on tin and tin alloy surface finishes	Moisture and insulation resistance
Thermal conductivity/thermal resistance	Conductive anodic filament resistance test
Thermal expansion	Volume and surface resistivity of dielectric materials
Glass transition temperature	Permittivity and Loss Tangent
Thermal decomposition temperature	Ionchromatography
Time to Delamination	Ionic analysis of circuit boards, Ion Chromatography Method
Resistance to soldering heat	Thermal stress
Solderability	Failure analysis

? NG28 Solution

NG28 provides a comprehensive one-stop solution of reliability testing, including:

Environmental test

Reliability test

Reliability design

Reliability analysis

Product evaluation

Reliability training and consulting

? Our Strengths

NG28 has many advanced equipments and has passed CMA/CNAS qualification accreditation, the test data is accurate and reliable, and the test report has international credibility.

The scientific laboratory information management system ensures the efficient operation of each service link.

The technical expert team has rich practical experience and can provide professional, rapid and comprehensive one-stop service.

The service network is all over the world, and many first-line brands designate cooperative laboratories.

? Service Process

Consult customer service → confirm the test plan → fill in the application form → send the sample → pay the test fee → test → send electronic report → express paper report

? Frequently Asked Question

How long does the test period take？

The normal period is 5-7 working days (except the time when the sample is in the test chamber). If you need urgent help, please contact our sales or customer service.

What are the test sample's requirements for peel strength test of metallic clad laminates?

Peel strength test requires customers to etch samples by themselves. It can be performed with the requirements of GB/T 4722 or IPC-TM-650 2.4.8C.

How is the test result of CAF test evaluated?

CAF( conductive anodic filament) can be evaluated by the change of insulation resistance after testing. And the growth of CAF can also be observed by sample microsections.

What are the pre-treatment conditions of solderability testing?

Steam aging, damp heat and dry heat are common conditions for sample pretreatment before weldability test.

How to choose the solderability test method?

If there is no regulation, it is generally recommended to choose Dip-look method for PCB sample, wetting balance method for single PCB solder plate or component pin, and wetting balance method for solder paste.

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