×÷ΪÖйúµÚÈý·½¼ì²âÓëÈÏÖ¤·þÎñµÄ¿ªÍØÕߺÍÁìÏÈÕߣ¬NG28ÄϹ¬28NGÏàÐÅÆ·ÅÆÁ¦Á¿¼ì²âΪȫÇò¿Í»§Ìṩһվʽ¼ìÑé¡¢²âÊÔ¡¢Ð£×¼¡¢ÈÏÖ¤¼°¼¼Êõ·þÎñ¡£
·þÎñÄÜÁ¦ÒÑÈ«ÃæÁýÕÖµ½·ÄÖ¯·þ×°¼°Ð¬°ü¡¢Ó¤Í¯Íæ¾ß¼°¼Ò¾ÓÉú»î¡¢µç×ÓµçÆ÷¡¢Ò½Ñ§½¡¿µ¡¢Ê³Æ·¼°Å©²úÎï……µÈÐÐÒµµÄ¹©Ó¦Á´ÉÏÏÂÓΡ£
È«Ãæ±£ÕÏÆ·ÖÊÓëÄþ¾²£¬Íƶ¯ºÏ¹æÓ봴У¬ÕÃÏÔÆ·ÅƾºÕùÁ¦£¬ÊµÏÖ¸ü¸ßÖÊÁ¿¡¢¸ü½¡¿µ¡¢¸üÄþ¾²¡¢¸üÂÌÉ«µÄ¿ÉÁ¬ÐøÉú³¤¡£
Ê×Ò³ > ÎÒÃǵķþÎñ > оƬ¼°°ëµ¼Ìå > ²âÊÔ·þÎñ > ·þÎñÏêÇé
NG28ÄϹ¬28NGÏàÐÅÆ·ÅÆÁ¦Á¿¼ì²âÒÑͨ¹ýCNAS/ISO17025/ISO9001×ÊÖÊÈϿɣ¬ÓµÓÐÍêÉÆµÄоƬʧЧ·ÖÎö¹¤¾ß£¬¿ÉΪÄúÌṩоƬʧЧ·ÖÎöÓëÏȽø¹¤ÒÕɸƬ·ÖÎö(DPA)¼ì²â·þÎñ£¬²âÊÔÊý¾Ý׼ȷ¿É¿¿£¬Í걸µÄʵÑéÊÒÐÅÏ¢¹ÜÀíϵͳ£¬±£ÕÏÿ¸ö·þÎñ»·½ÚµÄ¸ßЧ¡¢±£ÃÜÔËת¡£
Ëæ×ÅICÉè¼ÆÓëÖÆÔìÁ÷³ÌµÄ²»Í£Ñݽø£¬Õë¶Ô¼¯³Éµç·Æ÷¼þÒì³£µÄʧЧ·ÖÎö(Failure Analysis)±äµÃÓú¼ÓÖØÒª£¬ÄѶÈÒ²Óú¼ÓÌáÉý¡£Ê§Ð§·ÖÎöÁìÓòÖУ¬ÔÚ³ÉǧÉÏÍòµÄ¾§Ìå¹ÜÖÐÈçºÎ¼È¿ìËÙÓÖ׼ȷµÄ½øÐÐʧЧ¶¨Î»Óë·ÖÎö£¬ÒѳÉΪÌáÉýоƬÖÊÁ¿·Ç³£ÖØÒªÒéÌâ¡£
оƬÔÚÑаl¡¢Éú²ú»òʹÓùý³ÌÖб»¾²µç¡¢ÍâÁ¦Ó°í‘£¬ÌṩÍêÉÆÐ¾Æ¬Ê§Ð§·ÖÎöËùÐèÖ®¹¤¾ßEFA£¨µçÐÔʧЧ·ÖÎö£©¡¢PFA£¨ÎïÐÔʧЧ·ÖÎö£©¡¢DEFA(¶¯Ì¬Ê§Ð§·ÖÎö)¡¢ÏȽø¹¤ÒÕɸƬ·ÖÎö(DPA)×ÊÔ´ÓëÉ豸¡£
NG28ÄϹ¬28NGÏàÐÅÆ·ÅÆÁ¦Á¿¼ì²âÒÑͨ¹ýCNAS/ISO17025/ISO9001×ÊÖÊÈϿɣ¬ÓµÓÐÍêÉÆµÄоƬʧЧ·ÖÎö¹¤¾ß£¬¿ÉΪÄúÌṩоƬʧЧ·ÖÎöÓëÏȽø¹¤ÒÕɸƬ·ÖÎö(DPA)¼ì²â·þÎñ£¬²âÊÔÊý¾Ý׼ȷ¿É¿¿£¬Í걸µÄʵÑéÊÒÐÅÏ¢¹ÜÀíϵͳ£¬±£ÕÏÿ¸ö·þÎñ»·½ÚµÄ¸ßЧ¡¢±£ÃÜÔËת¡£
Ãæ¶ÔÊýÖÖʧЧģʽ£¬ÄϹ¬28NGÏàÐÅÆ·ÅÆÁ¦Á¿ÎµË¼²©µÄʧЧ·ÖÎöר¼Ò£¬¾ßÓзáÊ¢µÄ´ÓÒµ¾ÑéÓë¶´²ìÁ¦¡£¿ÉÌæ¿Í»§Öƶ¨¸ßЧµÄʧЧ·ÖÎöÁ÷³Ì£¬²¢ÌṩרҵµÄʧЧ·ÖÎöÕï¶Ï³ÂËß¡£
ÊÊÓòâÊÔ³ß¶È : ÐÖú¿Í»§Í¨¹ýJEDEC¡¢MIL—STD¡¢AEC-QµÈ¿É¿¿ÐÔ¹ú¼ÊÊÔÑé³ß¶È¡£
ÊÊÓòúÎﷶΧ: ¼¯³Éµç·оƬ¡¢¾§Ìå¹Ü¡¢MOS¹Ü¡¢PCBA…µÈ¡£
ͨÀýÑùÆ·ÒªÇó: ÇëÁªÏµ¿Í·þ£¬ÒÔ¾ßÌå³ß¶ÈΪ׼¡£
©¥ ·ÇÆÆ»µ·ÖÎö
³¬Òô²¨É¨ÃèÏÔ΢¾µ (CSAM/SAT)
2D & 3D X¹â¼ì²â (2D & 3D X-ray)
½ðÏàï@΢çR¡¢¼tÍâ¹âï@΢çR (3D-OM¡¢IR-OM)
©¥ µçÐÔʧЧ·ÖÎö
É黯ïØî÷΢¹âÏÔ΢¾µ (InGaAs)
À×Éä¹â×èÖµ±ä»¯Õì²â (OBIRCH)
ÈÈ·øÉäʧЧ¶¨Î»ÏÔ΢¾µ (Thermal EMMI)
¶¯Ì¬Î¢¹âÏÔ΢¾µ·ÖÎö£¨DEFA£©
¶¯Ì¬À×ÉäɨÃè·ÖÎö£¨DLAS£©
µç¹â̽²â/µç¹âƵÂʳÉÏñ£¨EOP/EOPM£©
©¥ ÎïÀíÐÔ/»¯Ñ§ÐÔʧЧ·ÖÎö
Laser/»¯Ñ§¿ª¸Ç (Decap)
ICÈ¥²ã (Delayer)
´«Í³½ØÃæÑÐÄ¥ (Cross-section)
ɨÃèʽµç×ÓÏÔ΢¾µ (SEM & EDX)
Àë×ÓÊø½ØÃæÑÐÄ¥/Å×¹â (CP)
ëpÊøÀë×ÓÊø½ØÃæ·ÖÎö(DB-FIB)
©¥ Êý¾Ý·ÖÎöÓë»ãÕû³ÂËß
©¥ ʧЧ·ÖÎö¹¤¾ßÓ¦ÓÃ×Éѯ¼°Åàѵ